Tools and Capabilities

MiNIC offers external researchers the tools and expertise to support projects in nanoscale device fabrication, material analysis, nanoparticle synthesis and characterization, two-dimensional materials, quantum computing, and applications of nanotechnology to the life sciences.

 

Use the links below to learn more about the capabilities of the Minnesota Nano Center and the Characterization Facility.

Device Fabrication

Tools for:

  • Optical, imprint, and electron beam lithography
  • Thin film deposition of metals, alloys, and ceramic compounds
  • Annealing, oxidation, and doping of substrates
  • Wet etching, reactive ion etching, and ion milling
  • Optical mask development

For a full list of fabrication tools, go to the web sites of the Minnesota Nano Center and CAEDM.

AFM Image

Materials Characterization

Tools for:

  • optical and electron microscopy
  • atomic and magnetic force microscopy
  • cryogenic microscopy methods
  • elemental and chemical imaging and spectroscopy
  • atomic and molecular structure analysis via X-ray, ion, or electron scattering;
  • nanomechanical and nanotribological probes
  • surface and thin-film metrology

Go here for a full list of tools in the Characterization Facility

Bionano and Nanoparticles

Tools for:

  • Nanoparticle synthesis
  • Particle size and shape analysis
  • Measuring particle zeta potential and isoelectric point
  • Cell culture and preservation
  • Safe handling of biosafety level two organisms
  • Confocal and fluorescence microscopy
  • Gel electrophoresis
  • UV-Vis spectrophotometry

Go here for a full list of nanoparticle tools.  Go here for a list of tools in the Bio-Nano Lab

Two Dimensional Materials

Tools for:

  • Graphene chemical vapor deposition, to allow single-layer graphene growth on up to 2 x 2 in2 Cu foils
  • Techniques for graphene film transfer onto a variety of substrates
  • Processing 2D Materials in a low-oxygen glovebox environment
  • Imaging 2-D material films and structures

More details on MINIC's 2-D materials capabilities